Didn't get the results you were looking for?
Click on the link for help and tips on how to
search OptiSales more effectively!
Optisales Logo
About Us Contact Us
 
 
  Keyword Search
 
 
  Browse By Category
 
 
  Browse By Manufacturer
 
 
 
 
Toray OF-2000 Flip-Chip Die Bonder
Manufacturer: Toray | Category:Semiconductor Manufacturing | List Price: $299,500.00
 
 
 

The Toray OF-2000 High Accuracy Automated Flip Chip Bonder is a high throughput sub-micron die bonder for bonding multi-chip modules, high performance laser die, MEMS components, and RF components.  The sub-micron accuracy of this die bonder is highly enabling for those needing accurate placement of die for precision optical alignment.  The automated die placement and bonding allow true wafer-scale alignment and bonding of flip-chipped die for high throughput without reduction in performance.

 
View related Items from this manufacturer
View related Items in this category
 
 
 
 
   
  Contact Optisales
 

Please fill out the form below to learn more about the item above;
NOTE: OptiSales, LLC will NEVER release your name or email address!
It is not in our interest to, and we DO respect your privacy! Click on the link for OptiSales Terms and Conditions.

   
 
 
 
Name *
Company *
Email *
Phone Number *
Preferred method of contact: *
Info needed for:
I found this site via:
Comments/Questions:
 
OptiSales sells high-quality used equipment to the Optoelectronics, Semiconductor, and MEMS Industries. Metrology equipment featuring AFM, Alpha Step, Auto EL ellipsometer, cd measurement, coating thickness monitor, film mapping, interferometer, leak detector, metallographic and inspection microscope, particle counter, RGA, shear test, spectrophotometer, stress measurement, and wafer mapping tools. Optoelectronics tools include Newport Autoalign, Ultralign, OSA, laser, wdm test, wdm source, optical power meter, and die bonder equipment. Semiconductor and MEMS tools include: aligner, bonder, coater, cleaver, cryopump, CVD, deposition, dicing saw, die attach, die bonder, e beam, etch, evaporation, fab, furnace, ICP, LPCVD, mask aligner, PECVD, plasma etcher, plasma asher, prober, profilometer, RIE, scribe break, spin rinse dryer, spinner, turbo pump, and other tools for vacuum and thin film processing. Manufacturers represented: Agilent, Airco Temescal, Alcatel, Allessi, Anatech, Applied Materials, Balzers, Beuhler, Branson, Bruce, Carl Zeiss, Coherent, CVC, Denton, Disco, Drytek, Dynatex, Ecomet, Edwards, Electrotech, EMI, Fibrpol, Filmtek, FSI, Gaertner, HP, Hewlett Packard, ILX Lightwave, Jeol, Karl Suss, Keithley, Kulike & Soffa, K&S, Lapmaster, LAM, Leybold, Leybold-Heraeus, Matrix, Melles Griot, Micro Automation, MRC, Nanometrics, Nanospec, Newport, Novellus, Perkin Elmer, Plasma Therm, Rudolph, Spectra Physics, Semifab, Semitool, Shinkawa, Sloan, Solitec, SPI, STC, Suss, SVG, Tamarack, Technics, Tegal, Teledyne, Teledyne TAC, Temescal, Tencor, Thermco, Toray, Ultratech, Unaxis, Unitek, Varian, Veeco, Westbond, Wyko, Zeiss, Zygo